- Device Characterization and Modeling
- Gate Drive and Other Auxiliary Circuits
- Devices Design and Fabrication
- Packaging and Integration
- Design and Optimazition of WBG Based Power Converters
- EMI Suppression and Reliability
- Converter Control.
The emergence of wide bandgap (WBG) semiconductor devices such as silicon carbide (SiC) and gallium nitride (GaN) devices promises to revolutionize next-generation power electronics converters. Featuring high breakdown electric field, low specific on-resistance, fast switching speed, and high junction temperature capability, these devices are beneficial for the efficiency, power density, reliability, and cost of power converters. WBG devices have been employed in some commercial and industrial products with more applications expected in near future. However, extremely fast switching and other superior characteristics of WBG device present new design challenges in gate drive and protection, packaging and layout, EMI suppression, and converter control, etc. Addressing these design and application issues is critical to the adoption, commercialization, and success of WBG based power electronics. This special session intends to report the latest progress in these important areas. Topics of interest include but are not limited to the following:
Laili Wang received the M.S. and Ph.D. degrees from the School of Electrical Engineering, Xi'an Jiaotong University, Xi'an, China, in 2007 and 2011, respectively. He is now a Full Professor with the Xi'an Jiaotong University. His research interests include wide bandgap power devices, package and integration, high density power conversion, wireless power transfer, and energy harvesting. Prof. Wang is the recipient of Outstanding Young Scholar Award from China Power Supply Society, China Electric Power Excellent Young Technological Talent Award from Chinese Society of Electrical Engineering. He is currently an Associate Editor for IEEE Transactions on Power Electronics and IEEE Journal of Emerging and Selected Topics in Power Electronics.
Kangping Wang is currently an Associate Professor with the School of Electrical Engineering, Xi'an Jiaotong University, Xi'an, China. He received the B.S. and Ph.D. degrees in electrical engineering from the Xi'an Jiaotong University, Xi'an, China, in 2012 and 2018, respectively. From August 2016 to August 2017, he was with the Department of ePOWER, Electrical and Computer Engineering, Queen's University, Kingston, ON, Canada, as a Visiting Scholar. He is an IEEE senior member. His research interests include high-frequency power conversion technologies, and applications of wide bandgap devices.
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